Semicon Summit Asia 2026

• Global market shifts, economic pressures, and demand outlook
• National industrial policies and their impact on global strategy
• Insights on navigating uncertainty in high-tech supply chains

ET Tan, Board Member, MIMOS Berhad

• AI and hyperscale cloud driving infrastructure shifts
• Opportunities in edge computing, automotive, and IoT
• Strategic bets: general-purpose vs. application-specific chips

J-Wing Teh, Director of Silicon Design Engineering, AMD

• Why packaging is now a business-critical decision, not just a manufacturing step
• How advanced packaging is enabling breakthroughs in AI, automotive, and edge computing
• Ecosystem Impact: Who’s leading the charge — and how collaboration across design, materials,
  and manufacturing is shaping the future

Accordion Content

• Building production capacity in different parts of the world
• How companies are managing costs, delays, and labor
• The impact of government funding and policy support

• Artificial intelligence is no longer just a cloud-based tool—it is becoming essential to everyday human work and life.
• The future of AI is unfolding at the edge, where real-time decisions are made in milliseconds. Agentic AI shows the way.
• As intelligent systems become more autonomous and collaborative, they are transforming how we build, move, and respond—faster, smarter, and more resilient than ever.

Poh Leng Eu, Senior Director, Package Innovation, NXP Semiconductors

• Reshoring vs. Globalization: The pros, cons, and costs of bringing manufacturing closer to home
• Partnerships and Redundancy: How leading companies are diversifying suppliers and regions to reduce risk
• Policy and Incentives: Understanding how government action is reshaping global supply dynamics — and where the opportunities lie

Susan Goh, Group VP, Central Materials Engineering, STMicroelectronics

• Founders and leaders share real-world growth stories
• What it takes to move from startup to global player
• Lessons learned through challenges and pivots

Soon Lee Yeap, Executive Vice President, Oppstar Berhad

• How great leaders prepare for the unknown
• Identifying the next big shift before it happens
• Final thoughts from industry veterans and special guests

Panelists:

Soon Lee Yeap, Executive Vice President, Oppstar Berhad

Susan Goh, Group VP, Central Materials Engineering, STMicroelectronics

Yet Foon Lai, Sr. Director – Hardware Design Engineering, Intel